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LMZ10505EXT
SNVS669G – JUNE 2010 – REVISED OCTOBER 2013
V IN
www.ti.com
VIN
VOUT
C comp
EN
LMZ10505EXT
FB
GND
R fbt
R comp
R fbb
Table 2. LMZ10505EXT Compensation Component Values (1)
V IN (V)
C O (μF)
ESR (m ? )
R fbt (k ? )
C comp (pF)
R comp (k ? )
Min
Max
22
47
100
2
2
1
20
20
10
200
124
82.5
27
56
120
1.5
1.4
1
5.0
3.3
150
150
150
220
220
22
47
100
150
150
150
220
220
1
10
26
15
31
2
2
1
1
10
26
15
31
5
25
50
30
60
20
20
10
5
25
50
30
60
63.4
63.4
44.2
63.4
76.8
118
76.8
49.9
40.2
43.2
49.9
40.2
48.7
180
220
220
220
220
39
82
180
330
330
270
390
330
1.21
16.5
23.7
23.7
57.6
9.09
8.45
4.12
2.0
11.5
25.5
15.4
35.7
(1)
In the special case where the output voltage is 0.8V, it is recommended to remove R fbb and keep R fbt , R comp , and C comp for a type III
compensation.
Estimate Power Dissipation And Board Thermal Requirements
Use the current derating curves in the Typical Performance Characteristics section to obtain an estimate of
power loss (P IC_LOSS ). For the design case of V IN = 5V, V OUT = 2.5V, I OUT = 5A, T A(MAX) = 85°C , and T J(MAX) =
125°C, the device must see a thermal resistance from case to ambient ( θ CA ) of less than:
6 CA <
T J(MAX) - T A(MAX)
P IC_LOSS
- 6 JC
(15)
(16)
Given the typical thermal resistance from junction to case ( θ JC ) to be 1.9°C/W (typ.). Continuously operating at a
T J greater than 125°C will have a shorten life span.
To reach θ CA = 27.5°C/W, the PCB is required to dissipate heat effectively. With no airflow and no external heat,
a good estimate of the required board area covered by 1oz. copper on both the top and bottom metal layers is:
Board Area_cm &
2
500 . o C x cm 2
6 CA W
(17)
(18)
As a result, approximately 18 square cm of 1oz. copper on top and bottom layers is required for the PCB design.
12
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